| 发明名称 |
RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond. |
| 申请公布号 |
EP2787039(A1) |
申请公布日期 |
2014.10.08 |
| 申请号 |
EP20120853475 |
申请日期 |
2012.10.24 |
| 申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
SHIMBA, YOICHI;FUJIMARU, KOICHI;NONAKA, TOSHIHISA |
| 分类号 |
C08G59/24;C08K3/36;C08K9/04;C08K9/06;C08K9/10;C08L63/00;C09J7/00;C09J9/02;C09J11/04;C09J163/00;H01L21/60;H01L23/00 |
主分类号 |
C08G59/24 |
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