发明名称 |
ELECTROLYSIS COPPER ALLOY FOIL AND ELECTROLYSIS COPPER ALLOY FOIL WITH CARRIER FOIL |
摘要 |
<p>An object of the present invention is to provide an electro-deposited copper-alloy foil excellent in infrared laser processability which enables uniform etching rate along a thickness direction in following etching process. To achieve the object, an electro-deposited copper-alloy foil obtained from electrolyzing of an electrolytic solution, wherein the electro-deposited copper-alloy foil has tin content of 8% by mass to 25% by mass is employed. In the electro-deposited copper-alloy foil, a grain in a crystal structure is preferably a columnar grain longitudinal along a thickness direction.</p> |
申请公布号 |
EP2787101(A1) |
申请公布日期 |
2014.10.08 |
申请号 |
EP20120852896 |
申请日期 |
2012.11.30 |
申请人 |
MITSUI MINING & SMELTING CO., LTD |
发明人 |
MATSUDA, MITSUYOSHI;YOSHIKAWA, KAZUHIRO;FUJIMOTO, TAKAO |
分类号 |
C25D1/04;C25D3/58;C25D7/00;C25D7/06;H05K1/09;H05K3/02 |
主分类号 |
C25D1/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|