发明名称 SPUTTERING APPARATUS
摘要 <p>The present invention, for a sputtering apparatus which is able to effectively decrease damage of a target in a process of sputtering, is to provide a sputtering apparatus equipped with a first magnet assembly extended in the first direction, having a first side surface and a second side surface mutually facing, extended in the first direction and a first lower surface connecting the first side surface and the second side surface, extended in the first direction; a first shield arranged in the first side surface of the first magnet assembly; and a first supporting part supporting one end and the other end of a first cylindrical tubular target having a first longitudinal axis which can be installed in order for the first magnet assembly and the first shield to be located inside and located to be parallel with the first direction.</p>
申请公布号 KR20140118186(A) 申请公布日期 2014.10.08
申请号 KR20130033662 申请日期 2013.03.28
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 SIM, JAE YUN;CHOI, SEUNG HO
分类号 C23C14/35 主分类号 C23C14/35
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