| 摘要 |
The present invention is to make a wafer in contact with the air in the UV curing process and the outer circumference of a liquid resin be in nitrogen atmosphere within a short period of time. A wafer adhering apparatus (1) of the present invention comprises: a stage (23) for maintaining a sheet (S); a resin supplying means (24) for supplying the liquid resin (5) onto the sheet; a pressing means (25) maintained to press a wafer (W) toward the sheet on the top of the stage; and a ultraviolet light irradiation means (28) for irradiating ultraviolet rays on the stage by passing through the stage. A plurality of nozzle openings (253) are formed to surround the wafer on the pressing means, and nitrogen is injected from the nozzle openings. |
