发明名称 SUBSTRATE TREATING APPARATUS
摘要 The present invention relates to a substrate processing apparatus. The substrate processing apparatus, according to an embodiment of the present invention, comprises: a housing; a plurality of opening/closing members for providing a driving force to open/close the housing; a fluid storage member for supplying a fluid to the opening/closing member; and a fluid dispensing unit which is connected to the fluid storage member through a supply line and dispenses the fluid supplied from the fluid storage member to each of the opening/closing members. The fluid dispensing unit includes: dispensing lines connected to each of the opening/closing members by being branched out from the supply line; and a fluid dispensing member located at the position where the dispensing lines are branched out from the supply line.
申请公布号 KR20140117758(A) 申请公布日期 2014.10.08
申请号 KR20130032249 申请日期 2013.03.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SEOK HOON;JUN, YONG MYUNG;KO, YONG SUN;KIM, KYOUNG SEOB;OH, JUNG MIN;LEE, KUN TACK;JEONG, JI HOON;CHO, YONG JHIN
分类号 H01L21/02;H01L21/205;H01L21/3065 主分类号 H01L21/02
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