| 摘要 |
An object of the present invention is to increase the joint strength between a bump electrode of a coil component and an internal terminal electrode below the bump electrode. To this end, a coil component (1) includes a thin-film coil layer (11) formed on a substrate (10) and bump electrodes (12a to 12d) formed on a surface of the thin-film coil layer (11). The thin-film coil layer (11) includes internal terminal electrodes (24a to 24d) connected respectively to corresponding one ends of spiral conductors (16, 17), a fourth insulating layer (15d) covering the internal terminal electrode (24a to 24d), and openings (ha to hd) formed in the insulating layer (15d) and through which the internal terminal electrode (24a to 24d) are exposed. The opening (ha to hd) has an extended portion running outward over a periphery of the corresponding internal terminal electrode in a plan view. Thus, both a top surface (TS) and a side surface (SS) of each of the internal terminal electrodes (24a to 24d) are exposed through the corresponding opening (ha to hd). The bump electrodes (12a to 12d) are each brought into contact with both the top surface (TS) and side surface (SS) of each of the internal terminal electrodes (24a to 24d) in the corresponding opening (ha to hd). |
