发明名称 |
RESIN COMPOSITION FOR LASER PROCESSING |
摘要 |
A resin composition for laser processing which is able to enhance laser processability with maintaining a resist performance of a resin after ultraviolet laser processing, and which can be, for example, used as a resist in forming a circuit of a printed wiring board is provided. Disclosed is a resin composition for laser processing containing a resin and an ultraviolet absorber, wherein the resin is a thermoplastic resin having a carboxyl group and having a softening temperature of from 70 to 140°C, and a content of the ultraviolet absorber is from 1 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin. |
申请公布号 |
KR20140119098(A) |
申请公布日期 |
2014.10.08 |
申请号 |
KR20147021872 |
申请日期 |
2013.02.20 |
申请人 |
DAI-ICHI KOGYO SEIYAKU CO., LTD. |
发明人 |
MURAKAMI SATOSHI;KIKUTA MANABU |
分类号 |
C08L33/04;C08K5/00;C08L101/02 |
主分类号 |
C08L33/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|