发明名称 Rectifier with vertical MOS structure
摘要 A method for manufacturing a rectifier with a vertical MOS structure is provided. A first trench structure and a first mask layer are formed at a first side of the semiconductor substrate. A second trench structure is formed in the second side of the semiconductor substrate. A gate oxide layer, a polysilicon structure and a metal sputtering layer are sequentially formed on the second trench structure. The rectifier further includes a wet oxide layer and a plurality of doped regions. The wet oxide layer is formed on a surface of the first multi-trench structure and in the semiconductor substrate. The doping regions are formed on a region between the semiconductor substrate and the second trench structure, and located beside the mask layer. The metal sputtering layer is formed on the first mask layer corresponding to the first trench structure.
申请公布号 US8853748(B2) 申请公布日期 2014.10.07
申请号 US201414150236 申请日期 2014.01.08
申请人 PFC Device Corp. 发明人 Chao Kuo-Liang;Chen Mei-Ling;Kuo Hung-Hsin
分类号 H01L21/02;H01L21/322 主分类号 H01L21/02
代理机构 WPAT, PC 代理人 WPAT, PC ;King Justin
主权项 1. A rectifier with a vertical MOS structure, the rectifier comprising: a semiconductor substrate, wherein a first multi-trench structure is formed in a first side of the semiconductor substrate, and a second multi-trench structure is formed in a second side of the semiconductor substrate; a wet oxide layer formed on a surface of the first multi-trench structure and in the semiconductor substrate; a mask layer formed on the first side of the semiconductor substrate corresponding to the first multi-trench structure and formed on the wet oxide layer; a gate oxide layer formed on a surface of the second multi-trench structure; a gate dielectric layer formed on a part of a surface of the gate oxide layer; a first polysilicon structure formed on the gate dielectric layer; a polysilicon oxide layer formed on the first polysilicon structure; a second polysilicon structure formed on the gate dielectric layer and the polysilicon oxide layer; a plurality of doping regions formed on a region between the semiconductor substrate and the second multi-trench structure, and located beside the mask layer; and a metal sputtering layer formed on the doped regions, the gate oxide layer and the second polysilicon structure corresponding to the second multi-trench structure, and formed on the mask layer corresponding to the first multi-trench structure, wherein the mask layer is exposed.
地址 New Taipei TW