Light emitting device, manufacturing method thereof, and optical device

摘要

The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

主权项

1. A light emitting device, comprising:
an integrally molded substrate having an upper surface a concave part hollowed out of the upper surface, and a first substrate lateral facing one side of an orthogonal direction with respect to the direction that is defined from the substrate toward the LED chip and is contained in the thickness direction of the substrate; a wiring pattern formed on at least one of the upper surface and the concave part; a lens directly bonded to the upper surface; an LED chip bonded to the concave part and exposed in a gap clipped between the substrate and the lens; a metal wire connecting to the LED chip; a back conductor layer formed on one side of the substrate that is opposite to the side of disposing the LED chip and comprising an end surface facing the same side as the first substrate lateral, and the end surface having a portion spaced apart from the first substrate lateral and another portion located on the same plane as the first substrate lateral; and a back covering portion covering the back conductor layer; wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip; and wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface, the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.