Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs

摘要

A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

主权项

1. A ball grid array (BGA) and via pattern, comprising:
a printed circuit board (PCB) having a surface on which a plurality of regions are formed; and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair comprising two nodes arranged in a diagonal orientation and the receive differential signal pair comprising two nodes arranged in a diagonal orientation, wherein each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.