Light emitting module with heatsink plate having coupling protrusions

摘要

Provided are a light emitting module and a backlight unit. The light emitting module comprises a module board comprising a plurality of first and second pads and a plurality of protrusion holes, a heatsink plate corresponding to a second surface opposite to a first surface of the module board, the heatsink plate comprising a plurality of protrusions respectively inserted into the protrusion holes of the module board, and a plurality of light emitting devices, each comprising a heatsink frame connected to the protrusions of the heatsink plate which comprises a first frame part on which the plurality of protrusions are disposed and a second frame part folded from the first frame part and disposed under the module board.

主权项

1. A light emitting module comprising:
a module board comprising a plurality of first and second pads on a first surface thereof and a plurality of first holes therein; a heatsink plate corresponding to a second surface opposite to the first surface of the module board, the heatsink plate comprising a plurality of first protrusions respectively inserted into the first holes of the module board; and a plurality of light emitting devices, each light emitting device comprising:
a heatsink frame connected to the first protrusions of the heatsink plate;a light emitting chip disposed on a top surface of the heatsink frame;a body coupled to the heatsink frame; andfirst and second lead frames connected to the first and second pads of the module board, wherein the heatsink plate comprises:
a first frame part on which the plurality of protrusions are disposed; anda second frame part folded from the first frame part and disposed under the module board, wherein the heatsink frame of each of the plurality of light emitting devices corresponds to one of the first protrusions of the heatsink plate, wherein the module board comprises a second hole spaced from the first holes, wherein the first frame part of the heatsink plate comprises a second protrusion coupled to the second hole of the module board, wherein the second protrusion has a height greater than a height of the first protrusion, wherein the second protrusion is located at an outer position than that of the plurality of first protrusions, wherein the second hole is located at an outer position than that of the plurality of first holes, and wherein the heatsink plate includes a plurality of third holes at a folded region between the first frame part and the second frame part.