| 发明名称 | Apparatus, system, and methods for weighing and positioning wafers | ||
| 摘要 | An apparatus for characterizing a wafer comprising an aligner comprising a chuck for receiving and rotating the wafer, a sensor for detecting the position of the wafer as it is rotated, a first actuator for lowering and raising the wafer vertically, and a second actuator for moving the chuck horizontally; and a weighing scale comprising a weight sensor disposed proximate to the aligner, and a cantilevered arm extending laterally from the weight sensor over the chuck of the aligner, the cantilevered arm having a through hole surrounding the chuck. The chuck is vertically movable relative to the weighing scale from a first position in which the wafer is supported by the chuck to a second position in which the wafer is supported by the cantilevered arm of the weighing scale. A method for characterizing a wafer using the instant apparatus is also disclosed. | ||
| 申请公布号 | US8851816(B2) | 申请公布日期 | 2014.10.07 |
| 申请号 | US201213436848 | 申请日期 | 2012.03.31 |
| 申请人 | Microtronic, Inc. | 发明人 | Fenske Reiner G.;Denu David S. |
| 分类号 | B65H5/08;G01G19/00;G01G19/52;G01G21/22 | 主分类号 | B65H5/08 |
| 代理机构 | Patent Innovations LLC | 代理人 | Hammond John M.;Patent Innovations LLC |
| 主权项 | 1. An apparatus for characterizing a wafer, the apparatus comprising: a) an aligner comprising a chuck for receiving and rotating the wafer, and a vertical actuator operatively connected to the chuck; and b) a weighing scale comprising a weight sensor disposed proximate to the aligner, and a cantilevered arm extending laterally from the weight sensor over the chuck of the aligner, the cantilevered arm having a through hole surrounding the chuck; wherein the chuck is vertically movable by the vertical actuator relative to the weighing scale from a first vertical position in which the wafer is supported by the chuck to a second vertical position in which the wafer is supported by the cantilevered arm of the weighing scale. | ||
| 地址 | Edgartown MA US | ||