| 摘要 |
Provided is a suction pad, which can suck, without using complicated equipment, subjects to be sucked, such as semiconductor wafers, without breaking the subjects to be sucked. A suction pad (1) is provided with: a porous pad section (7), which has an upper surface (7a), on which a semiconductor wafer (5) is to be placed, and a lower surface (7b); and a holding section (9) for holding the pad section (7). The pad section (7) has: a first portion (L), which is formed of a first porous material having a predetermined gas transmission quantity in the direction from the upper surface (7a) to the lower surface (7b) of the pad section (7); and a second portion (H), which is formed of a second porous material, which has a gas transmission quantity more than that of the first porous material, said gas transmission quantity being in the direction from the upper surface (7a) to the lower surface (7b) of the pad section (7). The holding section (9) directly connects pores in the first portion (L) and the pores in the second portion (H), said first portion and the second portion forming the pad section (7). |
