| 发明名称 | Liquid ejecting head and liquid ejecting apparatus | ||
| 摘要 | A liquid ejecting head has a flow channel substrate, an actuator formed on the flow channel substrate and having at least one mount, and a flexible wiring substrate electrically connected to the mount to supply a drive signal to the actuator. The mount of the actuator and the wiring substrate are bonded together using an epoxy adhesive agent containing p-aminophenol epoxy resin, bisphenol A epoxy resin, and bisphenol F epoxy resin. | ||
| 申请公布号 | US8851621(B2) | 申请公布日期 | 2014.10.07 |
| 申请号 | US201313850491 | 申请日期 | 2013.03.26 |
| 申请人 | Seiko Epson Corporation | 发明人 | Sato Masahiko;Kanaya Munehide;Yamazaki Toshinobu |
| 分类号 | B41J2/015;H05K1/00;B41J2/14 | 主分类号 | B41J2/015 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A liquid ejecting head comprising: a flow channel substrate; an actuator formed on the flow channel substrate and having at least one mount; and a flexible wiring substrate electrically connected to the mount to supply a drive signal to the actuator, wherein: the mount of the actuator and the wiring substrate are bonded together using an epoxy adhesive agent containing p-aminophenol epoxy resin, bisphenol A epoxy resin, and bisphenol F epoxy resin. | ||
| 地址 | JP | ||