| 摘要 |
<p>The present invention relates to a returning chamber of a vacuum treatment system which treats wafers, glass substrates for LCD panel within a vacuum. Especially, the returning chamber, according to the present invention, can endure higher vacuum by having at least some part of the lower part thereof in a curved shape equivalent to that of a side of a cylinder. Accordingly, the width of the lower part can be reduced to endure a certain level of vacuum, which leads to reduced manufacturing costs, and the transportation of the invention is easier due to the reduced weight.</p> |
