MEMS packaging scheme using dielectric fence

摘要

A packaging scheme for MEMS device is provided. A method of packaging MEMS device in a semiconductor structure includes forming an insulation fence that surrounds the MEMS device on the semiconductor structure. The method further includes attaching a wafer of dielectric material to the insulation fence. The lid wafer, the insulation fence, and the semiconductor structure enclose the MEMS device.

主权项

1. A device, comprising:
a substrate; electronic components in the substrate; a sensor configured to interact with the electronic components in the substrate; an enclosure positioned on the substrate, the enclosure including:
an exterior dielectric layer having a first portion, a second portion, and a third portion that couples the first portion to the second portion; andan interior conductive layer within the exterior dielectric layer, the interior conductive layer being on the third portion and between the first portion and the second portion; and a cover positioned on the enclosure, the cover configured to contact the first portion and the second portion of the exterior dielectric layer and the interior conductive layer to seal the sensor within the enclosure.