发明名称 Light emitting diode assembly and thermal control blanket and methods relating thereto
摘要 The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.
申请公布号 US8853723(B2) 申请公布日期 2014.10.07
申请号 US201113150556 申请日期 2011.06.01
申请人 E. I. du Pont de Nemours and Company 发明人 Simone Christopher Dennis;Carney Thomas Edward
分类号 H01L33/48;H01L33/60 主分类号 H01L33/48
代理机构 代理人
主权项 1. A light emitting diode assembly comprising: A. a filled polyimide layer having a filled polyimide layer first surface and a filled polyimide layer second surface; the filled polyimide layer consisting essentially of: i). a polyimide in an amount from 50 to 75 weight percent of the filled polyimide layer, the polyimide being derived from:a. at least 45 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, based on a total dianhydride content of the polyimide, andb. at least 50 mole percent of 2,2′-bis(trifluoromethyl) benzidine based on a total diamine content of the polyimide;ii). a white pigment in an amount from 20 to 50 weight percent of the filled polyimide layer and wherein the white pigmenta. is less than 800 nanometers in at least one dimension,b. has an average aspect ratio greater than 3:1,c. is less than the filled polyimide layer thickness in all dimensions; B. electrically conductive circuit traces formed on at least the filled polyimide layer first surface; C. at least one light emitting diode attached to the filled polyimide layer first surface or attached to the electrically conductive traces; and D. an encapsulant covering exposed surfaces of the light emitting diode and at least a portion of the filled polyimide layer first surface.
地址 Wilmington DE US
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