发明名称 |
Semiconductor device |
摘要 |
To inhibit a metal element contained in a glass substrate from being diffused into a gate insulating film or an oxide semiconductor film. A semiconductor device includes a glass substrate, a base insulating film formed using metal oxide over the glass substrate, a gate electrode formed over the base insulating film, a gate insulating film formed over the gate electrode, an oxide semiconductor film which is formed over the gate insulating film and overlapping with the gate electrode, and a source electrode and a drain electrode which are electrically connected to the oxide semiconductor film. In a region of the base insulating film that is present in a range of 3 nm or less from a surface of the base insulating film, the concentration of a metal element contained in the glass substrate is less than or equal to 1×1018 atoms/cm3. |
申请公布号 |
US8853697(B2) |
申请公布日期 |
2014.10.07 |
申请号 |
US201313776999 |
申请日期 |
2013.02.26 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd.;Sharp Kabushiki Kaisha |
发明人 |
Okazaki Kenichi;Matsuo Takuya;Yamamoto Yoshitaka;Matsukizono Hiroshi;Kanzaki Yosuke |
分类号 |
H01L29/04;H01L31/036;H01L31/0376;H01L31/20;H01L29/786 |
主分类号 |
H01L29/04 |
代理机构 |
Robinson Intellectual Property Law Office, P.C. |
代理人 |
Robinson Eric J.;Robinson Intellectual Property Law Office, P.C. |
主权项 |
1. A semiconductor device comprising:
a glass substrate containing a metal element; an oxide semiconductor film over the glass substrate; and an insulating film including metal oxide between the oxide semiconductor film and the glass substrate, wherein the insulating film includes a region in a range of 3 nm or less from a top surface of the insulating film, and wherein a concentration of the metal element in the region is less than or equal to 1×1018 atoms/cm3. |
地址 |
Atsugi-shi, Kanagawa-ken JP |