发明名称 Semiconductor device
摘要 To inhibit a metal element contained in a glass substrate from being diffused into a gate insulating film or an oxide semiconductor film. A semiconductor device includes a glass substrate, a base insulating film formed using metal oxide over the glass substrate, a gate electrode formed over the base insulating film, a gate insulating film formed over the gate electrode, an oxide semiconductor film which is formed over the gate insulating film and overlapping with the gate electrode, and a source electrode and a drain electrode which are electrically connected to the oxide semiconductor film. In a region of the base insulating film that is present in a range of 3 nm or less from a surface of the base insulating film, the concentration of a metal element contained in the glass substrate is less than or equal to 1×1018 atoms/cm3.
申请公布号 US8853697(B2) 申请公布日期 2014.10.07
申请号 US201313776999 申请日期 2013.02.26
申请人 Semiconductor Energy Laboratory Co., Ltd.;Sharp Kabushiki Kaisha 发明人 Okazaki Kenichi;Matsuo Takuya;Yamamoto Yoshitaka;Matsukizono Hiroshi;Kanzaki Yosuke
分类号 H01L29/04;H01L31/036;H01L31/0376;H01L31/20;H01L29/786 主分类号 H01L29/04
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A semiconductor device comprising: a glass substrate containing a metal element; an oxide semiconductor film over the glass substrate; and an insulating film including metal oxide between the oxide semiconductor film and the glass substrate, wherein the insulating film includes a region in a range of 3 nm or less from a top surface of the insulating film, and wherein a concentration of the metal element in the region is less than or equal to 1×1018 atoms/cm3.
地址 Atsugi-shi, Kanagawa-ken JP