Three dimensional integrated circuits

摘要

A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.

主权项

1. A method comprising:
accessing a first integrated circuit design from a memory; and converting, by using a computing device, a plurality of different circuit elements of the first integrated circuit design into a plurality of wire elements to form a second integrated circuit design, wherein the plurality of wire elements are configured to couple to at least one of a logic high source and a logic low source, wherein the first integrated circuit design is configured to perform a plurality of logic functions, and wherein the second integrated circuit design is configured to perform at least a portion of the plurality of logic functions, wherein the first integrated circuit design is programmable, and wherein the second integrated circuit design is non-programmable.