Microphone and accelerometer

摘要

The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6, covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7, covering the second layer 7 with a third layer 8, forming a plurality of trenches 9 in the third layer 8, removing a part 10 of the wafer 1 below a back side of the microphone layer 5, forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6, and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.

主权项

1. Apparatus comprising:
a wafer having a first layer, wherein the first layer is divided into a microphone layer and into an accelerometer layer, and wherein a part of the wafer below a back side of the microphone layer is removed and at least two wafer trenches are formed in the wafer below a back side of the accelerometer layer, and a front side of the microphone layer and a front side of the accelerometer layer are covered with a continuous second layer, wherein the second layer is covered with a third layer, and wherein a plurality of trenches is formed in the third layer and wherein a part of the second layer is removed through the plurality of trenches formed in the third layer.