发明名称 |
Substrate processing method |
摘要 |
A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder. |
申请公布号 |
US8851769(B2) |
申请公布日期 |
2014.10.07 |
申请号 |
US201314132592 |
申请日期 |
2013.12.18 |
申请人 |
Sokudo Co., Ltd. |
发明人 |
Kaneyama Koji |
分类号 |
G03D5/00;B05C13/02;G03B27/58;H01L21/677;H01L21/687;H01L21/67;G03F7/20 |
主分类号 |
G03D5/00 |
代理机构 |
Ostrolenk Faber LLP |
代理人 |
Ostrolenk Faber LLP |
主权项 |
1. A substrate processing method for subjecting a substrate to processing using a substrate processing apparatus arranged adjacent to an exposure device,
the substrate processing method comprising the steps of: forming a photosensitive film made of a photosensitive material on a top surface of the substrate by a photosensitive film forming unit of the substrate processing apparatus; cleaning a back surface of the substrate by a back surface cleaning unit of the substrate processing apparatus after the formation of the photosensitive film and before exposure processing by the exposure device; transporting the substrate after the back surface cleaning by the back surface cleaning unit to a temperature adjuster of the substrate processing apparatus while holding the substrate after the back surface cleaning using a first holder of the substrate processing apparatus; adjusting a temperature of the substrate by the temperature adjuster; transporting the substrate before the exposure processing from the temperature adjuster to the exposure device while holding the substrate before the exposure processing using a second holder of the substrate processing apparatus; and transporting the substrate after the exposure processing from the exposure device to a first platform of the substrate processing apparatus while holding the substrate after the exposure processing using a third holder of the substrate processing apparatus. |
地址 |
JP |