| 发明名称 |
Package arrangement and a method of manufacturing a package arrangement |
| 摘要 |
In various embodiments, a package arrangement is provided. The package arrangement may include a first package. The package arrangement may further include a through hole package including at least one contact terminal. The first package may include at least one hole in an encapsulant to receive the at least one contact terminal of the through hole package. The received at least one contact terminal may provide a solder contact. |
| 申请公布号 |
US8853849(B2) |
申请公布日期 |
2014.10.07 |
| 申请号 |
US201313786525 |
申请日期 |
2013.03.06 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Otremba Ralf;Hoeglauer Josef;Schredl Juergen;Schloegel Xaver;Schiess Klaus |
| 分类号 |
H01L21/82;H01L49/02 |
主分类号 |
H01L21/82 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package arrangement, comprising:
a first package; a through hole package comprising at least one contact terminal; wherein the first package comprises at least one hole in an encapsulant to receive the at least one contact terminal of the through hole package; and a solder contact on the received at least one contact terminal; wherein the at least one hole in the encapsulant is a through hole extending from a first main side of the first package to a second main side of the first package opposite the first main side; wherein the at least one contact terminal of the through hole package extends through the entire through hole from the first main side of the first package to the second main side of the first package and projects from the second main side of the first package. |
| 地址 |
Villach AT |
