发明名称 THz-wave generation /detection modules and devices including the same
摘要 Provided are a THz-wave generation/detection module and a device including the same, which increase heating efficiency and are miniaturized. The module includes a photomixer chip, a lens, a PCB, and a package. The photomixer chip includes an active layer, an antenna, and a plurality of electrode pads. The lens is disposed on the photomixer chip. The PCB includes a plurality of solder balls connected to the electrode pads, under the photomixer chip. The package surrounds a bottom and side of the PCB, and dissipates heating of the active layer, which is transferred from the electrode pad of the photomixer chip to the PCB, to outside.
申请公布号 US8853633(B2) 申请公布日期 2014.10.07
申请号 US201113309583 申请日期 2011.12.02
申请人 Electronics and Telecommunications Research Institute 发明人 Han Sang-Pil;Park Kyung Hyun;Ko Hyunsung;Kim Namje;Lee Chul-Wook;Lee Dong-Hun;Leem Young Ahn
分类号 G01J5/02;G01J3/42 主分类号 G01J5/02
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A THz-wave generation/detection module comprising: a photomixer chip comprising an active layer, an antenna, and a plurality of electrode pads; a lens disposed on the photomixer chip; a Printed Circuit Board (PCB) comprising a plurality of solder balls connected to the electrode pads, under the photomixer chip; and a package surrounding a bottom and side of the PCB, and dissipating heating of the active layer, which is transferred from the electrode pads of the photomixer chip to the PCB, to outside, wherein the PCB further comprises: a substrate body having a first center hole at a center thereof, and having a first outer hole at an edge of the first center hole; a plurality of via electrodes vertically connected to the solder balls, in the substrate body; and a plurality of ground plates horizontally connected to the via electrodes.
地址 Daejeon KR