发明名称 System, a method and a computer program product for CAD-based registration
摘要 A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement.
申请公布号 US8855399(B2) 申请公布日期 2014.10.07
申请号 US201213368306 申请日期 2012.02.07
申请人 Applied Materials Israel, Ltd. 发明人 Goren Zvi;Dodzin Nir Ben-David
分类号 G06K9/00 主分类号 G06K9/00
代理机构 Lowenstein Sandler LLP 代理人 Lowenstein Sandler LLP
主权项 1. A system of inspecting wafer area using a reference wafer area, the system comprising: a first input interface to obtain: calibration information including respective reference displacements of multiple frames comprised in the reference wafer area, and a target database including, for each out of multiple targets in each of the multiple frames, a target image of a given target and location information determined in design data coordinates with respect to the frame in which the given target is included, wherein the inspected wafer area and the reference wafer area are characterized by the same targets in corresponding frames; a second input interface to obtain a scanned image of the inspected wafer area; a correlator to define a search window in the scanned image for each out of multiple targets of the database, each search window defined based on the reference displacement of the frame in which the target is included;to calculate, for each out of the multiple targets, a target run-time displacement based on a correlation of the target image of a given target to at least a portion of an area of the scanned image which is defined by the search window corresponding to the given target, the target run-time displacement indicative of displacement of the corresponding scanned image in the design data coordinates; andto determine a frame run-time displacement in the inspected wafer area for each of multiple run-time frames based on the target run-time displacements determined for multiple targets in the respective run-time frame; and a processor to generate inspection results for the inspected wafer area, based on the frame run-time displacements, thereby positioning inspection data in the design data coordinates independently for each frame.
地址 Rehovot IE