Surface emitting laser device, surface emitting laser array, optical scanning device, image forming apparatus, and manufacturing method of surface emitting laser device

摘要

A disclosed surface emitting laser device includes a light emitting section having a mesa structure where a lower reflection mirror, an oscillation structure, and an upper reflection mirror are laminated on a substrate, the oscillation structure including an active layer, the upper reflection mirror including a current confined structure where an oxide surrounds a current passage region, a first dielectric film that coats the entire surface of an emitting region of the light emitting section, the transparent dielectric including a part where the refractive index is relatively high and a part where the refractive index is relatively low, and a second dielectric film that coats a peripheral part on the upper surface of the mesa structure. Further, the dielectric film includes a lower dielectric film and an upper dielectric film, and the lower dielectric film is coated with the upper dielectric film.

主权项

1. A method of manufacturing a surface emitting device including a mesa structure which becomes a light emitting section in a laminated body where a lower reflection mirror, an oscillation structure, and an upper reflection mirror are laminated on a substrate, the oscillation structure including an active layer, the upper reflection mirror including a current confined structure, and an emitting region including a part where the refractive index is relatively high and a part where the refractive index is relatively low, the method comprising:
forming a first dielectric film on an upper surface of the laminated body before the mesa structure is formed; forming a first resist pattern on an upper surface of the first dielectric film, the first resist pattern including a pattern defining an outer shape of the mesa structure and a pattern protecting a region corresponding to the part where the refractive index is relatively high in the emitting region; etching the first dielectric layer using the first resist pattern as an etching mask; forming a second resist pattern protecting a region corresponding to an entirety of the emitting region; forming the mesa structure; forming the current confined structure; and forming a second dielectric film on an upper surface of the laminated body where the current confined structure is formed, the second dielectric film being formed at a wet etching rate lower than the wet etching rate of the first dielectric film.