Semiconductor package substrate in particular for MEMS devices

摘要

A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

主权项

1. A device, comprising:
a package substrate including:
a dielectric core having a first surface; anda first conductive layer on the first surface of the core, the first conductive layer including:
a first plurality of routing lines; anda first support structure electrically isolated from the first plurality of routing lines on the first surface; and a die positioned on the first surface of the core, a first area of the first surface being covered by the die, the first area including portions of the first support structure, the first support structure being electrically isolated from the die.