Air-release features in cavity packages

摘要

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

主权项

1. A device package comprising:
a package housing defining a cavity; a motion sensor die mounted within the housing; and a hole extending through the housing, wherein the housing has a bottom surface comprising at least one electrical lead configured to convey electrical signals between the device package and a external board, the hole extending through the bottom surface.