Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

摘要

The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less.

主权项

1. An epoxy resin composition comprising a solid epoxy resin, silica, and at least one of a cyanate resin and a maleimide resin,
the silica consisting of a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less, wherein an amount of the silica nanoparticle is from 5 to 20 weight % with respect to a total amount of the epoxy resin composition, and an amount of the silica particle is from 30 to 80 weight % with respect to the total content of the epoxy resin composition.