| 发明名称 |
Method of forming a land grid array with discrete pads |
| 摘要 |
A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board. |
| 申请公布号 |
US8850699(B2) |
申请公布日期 |
2014.10.07 |
| 申请号 |
US201113197881 |
申请日期 |
2011.08.04 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Pymento Larry G.;Sass Tony C.;Wormsbecher Paul A. |
| 分类号 |
H01R9/00;H05K3/00;H05K3/40;H05K3/34 |
主分类号 |
H01R9/00 |
| 代理机构 |
|
代理人 |
Brown Katherine S.;Streets Jeffrey L. |
| 主权项 |
1. A method of forming a land grid array, comprising:
plating a printed circuit board to form a grid array of copper pads; soldering a discrete pad over each of the plated copper pads in the grid array; measuring variation in flatness of the printed circuit board as a function of location in the grid array; and selecting individual discrete pads each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board. |
| 地址 |
Armonk NY US |
