发明名称 Thermally stable diamond bonded materials and compacts
摘要 Thermally stable diamond bonded materials and compacts include a diamond body having a thermally stable region and a PCD region, and a substrate integrally joined to the body. The thermally stable region has a microstructure comprising a plurality of diamond grains bonded together by a reaction with a reactant material. The PCD region extends from the thermally stable region and has a microstructure of bonded together diamond grains and a metal solvent catalyst disposed interstitially between the bonded diamond grains. The compact is formed by subjecting the diamond grains, reactant material, and metal solvent catalyst to a first temperature and pressure condition to form the thermally stable region, and then to a second higher temperature condition to both form the PCD region and bond the body to a desired substrate.
申请公布号 US8852304(B2) 申请公布日期 2014.10.07
申请号 US201012689389 申请日期 2010.01.19
申请人 Smith International, Inc. 发明人 Middlemiss Stewart N.
分类号 B24D11/00;B24B1/00;B24D3/00;B24D18/00;C09K3/14;B22F7/06;E21B10/567;B22F5/00 主分类号 B24D11/00
代理机构 Osha Liang LLP 代理人 Osha Liang LLP
主权项 1. A method for forming a thermally stable diamond bonded compact comprising the steps of: combining together a volume of diamond grains to form a mixture, the mixture being substantially free of a metal solvent catalyst; positioning a reactant material adjacent the mixture at an eventual working surface or mixing reactant material with the mixture in a region forming the eventual working surface; placing a metallic substrate adjacent the mixture opposite the eventual working surface to form an assembly, subjecting the assembly to a first temperature and pressure condition to form a sintered thermally stable diamond bonded region being substantially free of metal solvent catalyst and being remote from the metallic substrate, wherein subjecting the assembly to the first temperature and pressure condition comprises heating the assembly to a temperature less than the melting temperature of the metal solvent catalyst; subjecting the assembly to a second temperature and pressure condition to form a sintered polycrystalline diamond region containing metal solvent catalyst and being adjacent the metallic substrate, and to form an attachment bond between the sintered polycrystalline diamond region and the metallic substrate, thereby forming the thermally stable diamond bonded compact.
地址 Houston TX US