MÉTODO PARA LIGAR UM PRIMEIRO SUBSTRATO A UM SEGUNDO SUBSTRATO, CONJUNTO DE SUBSTRATOS, KIT PARA O MÉTODO PARA LIGAR UM PRIMEIRO SUBSTRATO A UM SEGUNDO SUBSTRATO, PROMOTOR DE ADESÃO PARA UMA COMPOSIÇÃO DE PRIMER, MÉTODO PÁRA MELHORAR O DESEMPENHO DE UMA COMPOSIÇÃO DE PRIMER E COMPOSIÇÃO DE PRIMER

摘要

The invention pertains to a method for bonding a first substrate to a second substrate, including the steps of (a) applying to one or both of the substrates a primer composition that includes an adhesion promoter, which is an adduct prepared by the reaction of at least one aromatic polyisocyanate compound with an active hydrogen moiety of an organofunctional silane (e.g., an aminosilane, a mercapto-silane, or a combination thereof); (b) applying an adhesive to at least one of the substrates; and (c) assembling the two substrates. Another aspect of the invention the adhesion promoter is incorporated into a primer composition that includes a polymeric prepolymer with a free isocyanate content, and more specifically, at least one prepolymer (derived from the reaction of at least one aliphatic polyisocyanate and a polyol), which is at least partially reacted with an amino group of an aminosilane, wherein the aminosilane includes a plurality of alkoxy groups bound to silicon. The invention also contemplates kits that include the primer described herein and at least one adhesive.