发明名称 |
Sn ALLOY PLATING METHOD AND RECYCLING METHOD OF Sn ALLOY PLATING SOLUTION, AND EQUIPMENT FOR THESE |
摘要 |
PROBLEM TO BE SOLVED: To provide a Sn alloy plating method which can remove impurities and the like contained in a plating solution after use by making handling of the solution easy, and regenerates the plating solution efficiently.SOLUTION: Provided is a Sn alloy plating method which Sn alloy plates a material 12 to be plated installed in a cathode chamber 4 of a plating tank 1 partitioned by an anionic exchange membrane 2, by an electrolytic plating. In an anode chamber 3 of the plating tank 1 is placed an anode 11 made of Sn. A plating solution after removal of organic matter contained in the plating solution after use in the cathode chamber 4 for Sn alloy plating treatment is used as a plating solution in the anode chamber 3. While performing Sn alloy plating by supplying current between the material 12 to be plated in the cathode chamber 4 and the anode 11 made of Sn, Sn ions are fed to the plating solution in the anode chamber 3. |
申请公布号 |
JP2014189873(A) |
申请公布日期 |
2014.10.06 |
申请号 |
JP20130068552 |
申请日期 |
2013.03.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
HATTA KENJI;YAMASHITA HIROAKI |
分类号 |
C25D21/18;C25D21/14 |
主分类号 |
C25D21/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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