发明名称 Sn ALLOY PLATING METHOD AND RECYCLING METHOD OF Sn ALLOY PLATING SOLUTION, AND EQUIPMENT FOR THESE
摘要 PROBLEM TO BE SOLVED: To provide a Sn alloy plating method which can remove impurities and the like contained in a plating solution after use by making handling of the solution easy, and regenerates the plating solution efficiently.SOLUTION: Provided is a Sn alloy plating method which Sn alloy plates a material 12 to be plated installed in a cathode chamber 4 of a plating tank 1 partitioned by an anionic exchange membrane 2, by an electrolytic plating. In an anode chamber 3 of the plating tank 1 is placed an anode 11 made of Sn. A plating solution after removal of organic matter contained in the plating solution after use in the cathode chamber 4 for Sn alloy plating treatment is used as a plating solution in the anode chamber 3. While performing Sn alloy plating by supplying current between the material 12 to be plated in the cathode chamber 4 and the anode 11 made of Sn, Sn ions are fed to the plating solution in the anode chamber 3.
申请公布号 JP2014189873(A) 申请公布日期 2014.10.06
申请号 JP20130068552 申请日期 2013.03.28
申请人 MITSUBISHI MATERIALS CORP 发明人 HATTA KENJI;YAMASHITA HIROAKI
分类号 C25D21/18;C25D21/14 主分类号 C25D21/18
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