| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem that when an equalizer is formed on the inner layer of a dielectric multilayer substrate, the adjustment part for changing the frequency characteristics of the equalizer enters the inner layer of the substrate to disable the adjustment itself, and thereby it is difficult to form a functional circuit like an equalizer on the inner layer of a dielectric multilayer substrate, and miniaturization is disturbed.SOLUTION: On the inner layer of a dielectric multilayer substrate, a quarter-wavelength transmission line, an inner layer tip open stub, and a tip short circuit stub are provided. On the surface layer of the dielectric multilayer substrate, a surface layer tip open stub connected with the inner layer tip open stub via a through hole and a conductor pattern for capacity adjustment are provided. The frequency characteristics are changed by selecting whether or not the conductor pattern for capacity adjustment and the surface layer tip open stub are connected.</p> |
