PRINTED WIRING BOARD, TEMPERATURE CONTROL PROGRAM THEREFOR, TEMPERATURE CONTROL METHOD THEREFOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To uniformize a temperature of a printed wiring board on which a heating component is mounted.SOLUTION: A printed wiring board, on which electronic components (4, 41, 42...4N) are mounted, includes: a fluid (low boiling point solvent 18 and fluid 20) that flows while absorbing heat from the electronic components; and a flow pass (circulation path 16) formed in isolation layers (14, 14-1) on a high-temperature side and a low-temperature side or a conductor layer. The fluid having absorbed the heat from the electronic components flows through the flow pass and moves from the high-temperature side to the low-temperature side. Thus, a temperature of the printed wiring board is uniformized.