| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which can convey a substrate without applying particle on a surface of the substrate.SOLUTION: A plating apparatus comprises: a processing tank 110 keeping process liquid therein; a substrate holder 8 holding a substrate W; a transporter 100 that soaks the substrate holder 8 holding the substrate W in process liquid in the processing tank 110, pulls up the substrate holder 8 from the processing tank 100, and conveys the substrate holder 8; and an air current formation device 200 forming clean air current in a conveying direction of the substrate holder 8 ahead of the substrate W. The transporter 100 moves the air current formation device 200 in a horizontal direction integrally with the substrate holder 8 while the substrate holder 8 is conveyed horizontally. |
