POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PRODUCING CURED PATTERN USING THE SAME, RELIEF PATTERN OBTAINED THEREBY, AND LIGHT EMITTER HAVING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which exhibits excellent adhesion to a substrate, does not cause resist burning or carbonization even in heat treatment at 100°C-300°C, and provides a cured film allowing easy removal with a resist stripping solution.SOLUTION: A positive photosensitive resin composition comprises: a polyamic acid or polyamic acid ester comprising a structural unit represented by the general formula (1) as a main component; a naphthoquinonediazide compound; and a silane compound represented by the general formula (2), where r is an integer 2 or 3.