HIGH THERMAL CONDUCTIVE RESIN CURED PRODUCT, HIGH THERMAL CONDUCTIVE SEMI-CURED RESIN FILM AND HIGH THERMAL CONDUCTIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a high thermal conductive resin cured product, a high thermal conductive semi-cured resin film and a high thermal conductive resin composition having both excellent thermal conductivity and excellent voltage-withstanding characteristics.SOLUTION: There is provided a high thermal conductive resin cured product which includes a resin and a filler, wherein a) the content of the filler is in the range of 75 to 90 vol.% of the whole high thermal conductive resin cured product; b) the content of a large particle-diameter filler having an average particle diameter Dof 40 to 60μm is in the range of 50 to 75 vol.% based on the filler; c) 80 vol.% or more of the large particle-diameter filler is an aluminum nitride powder; d) the content of a filler having a particle diameter of 100μm or more is 12 vol.% or less based on the large particle-diameter filler; and e) the high thermal conductive resin cured product has a film thickness in the range of 150 to 200μm.