| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus, a film deposition method, and a film deposition program that can make uniform film characteristics, such as a film thickness and film hardness, of a coating formed on a surface of a material to be processed.SOLUTION: A film deposition apparatus includes: a microwave supply part which supplies a microwave for generating plasma along a processing surface of a conductive material to be processed; a negative voltage application part which applies the material to be processed with a negative bias voltage for expanding a sheath layer along the processing surface of the material to be processed; and a control part which controls the microwave supply part and negative voltage application part. The microwave supply part has a microwave supply opening which propagates the microwave to be supplied to the expanded sheath layer, and the control part controls the microwave supply part and negative voltage application part so as to change a sheath thickness of the sheath layer during the supply of the microwave. |
