| 摘要 |
The subject of the present invention is to join a base material such as ceramics, semiconductor, glass at the temperature of processing such a solder material without a metallizing process. A joined structure for solving the subject at hand has multiple base materials joined by including a joint layer, has a base material of at least one side be any one base material among ceramics, a semiconductor, and a glass, and has a joint material layer include metal and oxide, wherein the oxide includes V and Te, and the oxide exists between the metal and the base material. The joint material is provided in a paste form including an oxide glass including V and Te as components, metal particles, and a solvent; a film or plate form filled with particles of an oxide glass including V and Te as components, or a film or plate form including a oxide glass layer including V and Te as components and metal layer. |
