| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe device which accurately performs inspection without causing warpage and damages to a placement base even when a temperature is controlled in a wide temperature range to perform the inspection of a semiconductor device formed in a semiconductor wafer.SOLUTION: A probe device performs electric inspection of a semiconductor device formed in a semiconductor wafer and includes: a placement base for placing the semiconductor wafer; a drive mechanism which places a probe in contact with an electrode of the semiconductor device placed on the placement base; and a temperature control mechanism for controlling a temperature of the placement base. The placement base includes: a first electrode plate; a second electrode plate; and an insulation plate disposed between the first electrode plate and the second electrode plate. The first electrode plate, the second electrode plate, and the insulation plate are fixed by a fixing member at a center part and are locked in a lock section, which is disposed at a radial outer part relative to the fixing member, so as to move in a radial direction. |
