| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin multilayer substrate which is also available even for the purpose to which severe characteristic setting is required, by making characteristic variance hard to occur even when a bent portion and a flat portion are formed by heating/bending the resin multilayer substrate.SOLUTION: The manufacturing method of a resin multilayer substrate includes a heating/bending step of forming a flat portion and a bent portion through heating/bending using a die on a laminate in which a circuit pattern is provided by laminating a plurality of thermoplastic resin layers. In the heating/bending step, the laminate is bent via an interposition member which makes heat conductivity between the die and the flat portion lower than heat conductivity between the die and the bent portion. |
