发明名称 SUBSTRATE FOR SUSPENSION
摘要 PROBLEM TO BE SOLVED: To improve strength of a flying lead.SOLUTION: A substrate for suspension includes: a metal support substrate; an insulator layer formed on the metal support substrate; and a wiring layer formed on the insulator layer. In each of the metal support substrate, the insulator layer and the wiring layer, an opening is formed, and a terminal part extending from one end of the opening to the other end and connected to an external circuit board is formed. The terminal part includes: a terminal part metal support substrate; a terminal part insulator layer formed on the terminal part metal support substrate; and a terminal part wiring layer formed on the terminal part insulator layer. The terminal part wiring layer is electrically connected to the wiring layer.
申请公布号 JP2014191845(A) 申请公布日期 2014.10.06
申请号 JP20130067203 申请日期 2013.03.27
申请人 DAINIPPON PRINTING CO LTD 发明人 HIRATA KENRO
分类号 G11B5/60;G11B21/21;H05K1/05 主分类号 G11B5/60
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