| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with which excellent bonding properties of a lead can be obtained when a semiconductor device is mounted on a substrate.SOLUTION: In a frame material 11 of a lead frame 10, a plurality of connection leads 16 connected to each other by a dam bar 15 are formed. The connection leads 16 include: an inner lead 17 extending from the dam bar 15 to an inner side; and an outer lead 18 extending from the dam bar 15 to an outer side. The outer lead 18 includes a plating layer 23 covering a lower surface 11a and both side surfaces 11b and 11c of the frame material 11. The material of the outer lead 18, copper or a copper alloy, is exposed because an upper surface 11d of the frame material 11 is not covered by the plating layer 23. |
