SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device having an alignment mark capable of being used in a manufacturing process.SOLUTION: A semiconductor device manufacturing method comprises: a process S1 of preparing an SOI substrate 1 having a first region A1 and a second region A2; a process S2 of forming an alignment mark M in the second region A2; a process S3 of etching the second region A2 to form a level difference D; a process S4 of forming a second substrate 21; a process S7 of bonding the second substrate 21 to the SOI substrate 1 to form a third substrate 29; a process S8 of removing a wafer 22 from the third substrate 29 to form a fourth substrate 33; and a process S9 of removing an epitaxial layer 23 on the second region A2 from the fourth substrate 33 to form a semiconductor substrate 34.