| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which eliminates an electrical short circuit between solder bumps caused by warpage and which can cause a mounting semiconductor element to normally operate.SOLUTION: A wiring board comprises: a core substrate 1 having a number of through holes 5; build-up insulation layers 2 and build-up wiring layers 3 which are alternately laminated one on top of the other on each of the top face and an undersurface of the core substrate 1; semiconductor element connection pad formation regions on a top face central part, in which a number of semiconductor element connection pads 7 are arranged in a reticular pattern; first through holes arranged in a first region X in the core substrate 1 opposite to the semiconductor element connection pad formation region A with a first arrangement density; second through holes arranged in each second region Y on an outer periphery of the core substrate 1 and at a distance from the first region X with a second arrangement density lower than the first arrangement density; and third through holes arranged in each third region Z between the first region X and the second region Y with a third arrangement density higher than the second arrangement density. |
