| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with good transmission characteristics of a high-frequency signal.SOLUTION: The wiring board includes an insulating substrate 1, an electrode pad 2 provided on a main surface of the insulating substrate 1, and a metal pattern 4 which is provided in the insulating substrate 1 and is different in potential from the electrode pad 2. The electrode pad 2 is provided on the main surface of the insulating substrate 1 and includes a first metal layer 5, at least part of which is buried in the insulating substrate 1 in the thickness direction, and a second metal layer 6 laminated on the first metal layer 5. The outer circumference of the first metal layer 5 is positioned inside the outer circumference of the second metal layer 6 in a plan view. |
