| 摘要 |
PROBLEM TO BE SOLVED: To prevent variation in light quantity and to prevent degradation of yield in a dicing step, by evenly packing with a simple method when packing with transparent sealing resin, in a cavity part formed as a reflector in an LED package.SOLUTION: In a lead frame for an LED light emitting element, a reflector part of a resin mold body is provided with a bottom surface part and a cavity part which has an opening part larger than the bottom surface part, and the bottom part of the cavity part is provided with pad parts at one or a plurality of points for mounting an LED light emitting element, and a lead part having an electrical connection area for electrical connection to the LED light emitting element. At a part surrounding the opening part of the cavity part, on a surface of the reflector part, at least one groove part is formed which has a width 0.01-0.30 mm and depth 0.01-0.35 mm. |
