SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BUILDUP FILM COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD INCLUDING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: a surface-modified inorganic filler capable of improving dispersibility in an epoxy resin by compatibility with the resin, while reducing the dielectric loss factor; and a method of preparing the same, a buildup film composition for a multilayer printed wiring board, and a multilayer printed wiring board including the same.SOLUTION: Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; subjecting the inorganic filler to fluorine treatment to bond fluorine (F) to a part of a surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to a fluorine-unbonded surface of the fluorine-bonded inorganic filler.