| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor integrated circuit device capable of supplying wafer-in-plane distribution even when a measurement position is restricted.SOLUTION: The method for manufacturing a semiconductor integrated circuit device includes a measurement step of measuring a plurality of LSI chip regions or a shot region in a photolithography step used when the plurality of LSI chip regions are produced. An in-plane distribution configuration step is further included, in which a wafer-in-plane distribution indicating a distribution in plane of a product wafer is configured by generating a two-dimensional element using a plurality of measurement position coordinates measured in the measurement step and the result of measurement at the plurality of measurement position coordinates, and covering the product wafer with a plurality of two-dimensional elements. Evaluation between a plurality of product wafers is conducted using the wafer-in-plane distribution configured for each of the plurality of product wafers.</p> |
