发明名称 METHOD FOR MANUFACTURING LID BODY AGGREGATE AND ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a highly productive method for manufacturing a lid body aggregate and an electronic device.SOLUTION: A substrate 600 for a lid includes a plurality of tabular lids 130 placed planarly and leadframes 610 and 620 storing the lids 130. From a joint surface which is one principal surface of the lids 130, a principal surface of a junction side of leadframes 610 and 620 is separated by a thickness of the lid 130 or more to another principal surface side of the of lid 130.</p>
申请公布号 JP2014192396(A) 申请公布日期 2014.10.06
申请号 JP20130067541 申请日期 2013.03.27
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO KAZUHISA;SAIBA KOJI
分类号 H01L23/02;H03H3/02;H03H9/02 主分类号 H01L23/02
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