发明名称 |
METHOD FOR MANUFACTURING LID BODY AGGREGATE AND ELECTRONIC DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly productive method for manufacturing a lid body aggregate and an electronic device.SOLUTION: A substrate 600 for a lid includes a plurality of tabular lids 130 placed planarly and leadframes 610 and 620 storing the lids 130. From a joint surface which is one principal surface of the lids 130, a principal surface of a junction side of leadframes 610 and 620 is separated by a thickness of the lid 130 or more to another principal surface side of the of lid 130.</p> |
申请公布号 |
JP2014192396(A) |
申请公布日期 |
2014.10.06 |
申请号 |
JP20130067541 |
申请日期 |
2013.03.27 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HASHIMOTO KAZUHISA;SAIBA KOJI |
分类号 |
H01L23/02;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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